According to the requirements of different production processes and high and low temperature environments, we select high performance ageing resistant UV adhesive/NONE-BLOOMING cyanoacrylate adhesive/modified epoxy/silicone rubber, which can be applied to the bonding and gasketing of a variety of materials such as plastic, metal, and glass.

Typical application of the bonding, reinforcement, fixing, protection for PCB assembly and various electronic components such as BGA/CSP/QFP, featuring such characteristics as low temperature curing , high bonding strength, good thermal and humid resistance, good electrical performance, etc.They are hard to wire draw or collapse, which provide circuit board elements with effective protection, fixing, thermal conductivity, etc. They are of good insulativity and excellent humid, thermal and coldness resistance, which can ensure the long term operation of the electronic products.

Including SMT adhesive which passes the wave soldering and reflow soldering tests, low dilatation coefficient COB adhesive(daming and encapsulating), high strength FPC line reinforcement adhesive, BGA underfill and corner fixing with less stress and low curing temperature, tenacious ITO coating which passes the cross cut test, 180 degree bending test and salt spray and organic solvent test, and wire tacking adhesive with NONE-BLOOMING and fast positioning.