According to the requirements of thermal conductivity and high and low temperatures, we select high-performance ageing resistant modified epoxy/silicone rubber/urethane adhesives, which can be applied to the bonding and gasketing of a variety of materials such as plastic, metal, and glass.

Thermally conductive encapsulant/silicone grease/gelatum are used for gasketing, bonding, insulation, moisture proof, and thermal conduction. As bonding and potting materials for electronic components, semiconducting equipmetns as well as electronic and electrical devices, they are used for thermal dissipation of CPUs of electronic and electrical devices, the power, transistors and thermistors, bonding and gasketing, as well as bonding and insulation of PTC, especially suitable for bonding and gasketing with higher requirements for thermal conductivity.

With excellent thermal conductivity, they can quickly release heat out of the heating units so that the units can be cooled. They have excellent thermal diffusivity and adhesive quality to most metal and none-metal materials, so that they can be applied to the bonding, gasketing, and thermal conductivity of various electronic components. They are of good high temperature, humidity, heat, coldness, shock, weathering and aging resistance and have low curing shrinkage.