^* Typical application of the bonding, reinforcement, fixing, protection for PCB assembly and various electronic components such as BGA/CSP/QFP, featuring such characteristics as low temperature curing , high bonding strength, good thermal and humid resistance, good electrical performance, etc.They are hard to wire draw or collapse, which provide circuit board elements with effective protection, fixing, thermal conductivity, etc. They are of good insulativity and excellent humid, thermal and coldness resistance, which can ensure the long term operation of the electronic products.

^* The emerging of various wireless communication systems and high-frequency electronic devices leads to mounting problems such as electromagnetic interferences and electromagnetic pollution and its consequencing EMI severely affects the normal operation of various precision electronics.

^* Micro-electroics assembly, including wires and printed circuit, electroplated baseboards, metal layers of ceramic adherends, metal chassis linkage, bonding of wires and tube sockets, bonding of components and printed wires that go through the surface holes, bonding of waveguide tuning as well as repairment of holes, has replaced traditional soldering techniques and is widely used in mobile communication and automobile industry.

^* Thermally conductive encapsulant/silicone grease/gelatum are used for gasketing, bonding, insulation, moisture proof, and thermal conduction. As bonding and potting materials for electronic components, semiconducting equipmetns as well as electronic and electrical devices, they are used for thermal dissipation of CPUs of electronic and electrical devices, the power, transistors and thermistors, bonding and gasketing, as well as bonding and insulation of PTC, especially suitable for bonding and gasketing with higher requirements for thermal conductivity.

^* We strengthen the integrality of electron devices to improve the resistance to external impact and shock; we improve the insulativity of internal components and circuits, which are conductive to the production of smaller and lighter devices; we avoid direct exposure of components and circuits to improve their waterproof and moistureproof properties, so that the products can resist water, humidity, corrosion, shock, thermal, and have good insulativity, thermal conductivity, and gasketing quality.

^* Different types of precious metal protectants and special protective greases for micro switches, which are easy to use and dry quickly under room temperature. They will not affect the solderability and various electrical performance indicators and are suitable for mass industrial production.